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Test Report Sample

Testing

Quality Inspection Report for Electronic Components

As an industry-leading distributor of electronic components, Ampheo Electronics strives for excellence and keeps improving our components and product requirements. To meet our promise to strictly control product quality and provide reliable quality, We have widely cooperated with many third-party qualificated and certificated quality inspection testing labopatories, such as White Horse Lab, GD4 Tet Services, etc. The following is samples we offer our customers. You can also get the sample testing report, if you order electronics components from us and need this kind of sample testing report.

TESTING REPORTS SAMPLESThrough third-party electronic testing lab, we are sure that the quality of products is high and original.

XILINX FPGAs Test Report
XILINX FPGAs Test Report
External Visual Inspection on 8 PCS samples marked with D/C 2101
Counterfeit Test Report
Counterfeit Test Report
The counterfeit screening process will identify remarked and defective devices
ALTERA FPGAs Test Report
ALTERA FPGAs Test Report
The test in the attachment were conducted according to the indicating procedures.
IC X-Ray Inspection Report
IC X-Ray Inspection Report
This test process is performed in accordance with MIL-STD-883.
Key Functional Testing (KFT)
Key Functional Testing (KFT)
Engineers design a circuit to check the parts key features as detailed on the data sheet.
MCU Programming Test Report
MCU Programming Test Report
Test to program/erase a variety of device types with MFC, customer or end user.
Solderability Analysis Report
Solderability Analysis Report
Solderability testing is performed per MIL-STD-883. This test is considered destructive.
External Visual Inspection
External Visual Inspection
Inspection on all incoming material following IDEA 1010 and MIL-STD-883 standards.
Decapsulation Report
Decapsulation Report
A destructive die verification process involves exposing the internal die of an IC component.
Destructive Physical Analysis (DPA)
Destructive Physical Analysis (DPA)
It is a systematic, detailed analysis of parts during various stages of physical disassembly.
Cross Section Analysis Report
Cross Section Analysis Report
A method of analyzing data about the electronic components at a specific time.
Scanning Acoustic Tomography
Scanning Acoustic Tomography
A non-destructive testing method through Scanning Acoustic Tomography Equipment

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