Renesas Electronics Corporation
UPD70F3824GB(S)-GAH-AX
Microcontrollers
UPD70F3824GB(S)-GAH-AX
4-UPD70F3824GB(S)-GAH-AX
32BIT MCU V850ES/JX3-H A064_1010
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UPD70F3824GB(S)-GAH-AX Description
V850ES V850ES/Jx3-H Microcontroller IC 32-Bit 48MHz 256KB (256K x 8) FLASH 64-LFQFP (10x10)
Tech Specifications
Core Processor
V850ES
Speed
48MHz
Operating Temperature
-40°C ~ 85°C (TA)
Program Memory Type
FLASH
RAM Size
24K x 8
Number of I/O
45
Peripherals
DMA, LVD, PWM, WDT
Mounting Type
Surface Mount
Product Status
Active
Oscillator Type
Internal
Supplier Device Package
64-LFQFP (10x10)
EEPROM Size
-
Series
V850ES/Jx3-H
Package / Case
64-LQFP
Core Size
32-Bit
Mfr
Renesas Electronics Corporation
Connectivity
CSI, EBI/EMI, I2C, UART/USART, USB
Program Memory Size
256KB (256K x 8)
Package
Tray
Data Converters
A/D 10x10b SAR; D/A 1x8b
Voltage - Supply (Vcc/Vdd)
2.85V ~ 3.6V
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
UPD70F3824GB(S)-GAH-AX Documents
Download datasheets and manufacturer documentation for UPD70F3824GB(S)-GAH-AX
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