Renesas Electronics Corporation
UPD70F3371M2GBA1-GAH-E2-AX
Microcontrollers
UPD70F3371M2GBA1-GAH-E2-AX
4-UPD70F3371M2GBA1-GAH-E2-AX
32BIT MCU V850ES/FE3
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UPD70F3371M2GBA1-GAH-E2-AX Description
V850ES V850ES/Fx3 Microcontroller IC 32-Bit 32MHz 256KB (256K x 8) FLASH 64-LFQFP (10x10)
Tech Specifications
Core Processor
V850ES
Speed
32MHz
Operating Temperature
-40°C ~ 110°C (TA)
Program Memory Type
FLASH
RAM Size
16K x 8
Number of I/O
51
Peripherals
DMA, LVD, POR, PWM, WDT
Mounting Type
Surface Mount
Product Status
Active
Oscillator Type
Internal
Supplier Device Package
64-LFQFP (10x10)
EEPROM Size
32K x 8
Series
V850ES/Fx3
Package / Case
64-LQFP
Core Size
32-Bit
Mfr
Renesas Electronics Corporation
Connectivity
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Program Memory Size
256KB (256K x 8)
Package
Tape & Reel (TR)
Data Converters
A/D 10x10b SAR
Voltage - Supply (Vcc/Vdd)
3.3V ~ 5.5V
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
UPD70F3371M2GBA1-GAH-E2-AX Documents
Download datasheets and manufacturer documentation for UPD70F3371M2GBA1-GAH-E2-AX
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