NXP Semiconductors_SPC5777CSK3MME4
NXP Semiconductors_SPC5777CSK3MME4
NXP Semiconductors

SPC5777CSK3MME4

Microcontrollers
NXP Semiconductors
SPC5777CSK3MME4
4-SPC5777CSK3MME4
POWER ARCH CORES, 8MB FLASH, 300
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SPC5777CSK3MME4 Description

e200z7 MPC57xx Microcontroller IC 32-Bit Tri-Core 300MHz 8MB (8M x 8) FLASH 416-MAPBGA (27x27)

Tech Specifications

Mfr
NXP USA Inc.
Series
Automotive, AEC-Q100 MPC57xx
Package
Tray
Core Processor
e200z7
Program Memory Type
FLASH
RAM Size
512K x 8
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
416-BGA
Supplier Device Package
416-MAPBGA (27x27)
Speed
300MHz
Core Size
32-Bit Tri-Core
Connectivity
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals
DMA, LVD, POR, Zipwire
Program Memory Size
8MB (8M x 8)
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
Data Converters
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type
External, Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert

SPC5777CSK3MME4 Documents

Download datasheets and manufacturer documentation for SPC5777CSK3MME4

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