NXP Semiconductors
SPC5775BDK3MME2
Microcontrollers
SPC5775BDK3MME2
4-SPC5775BDK3MME2
IC MCU 32BIT 4MB FLASH 416MAPBGA
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SPC5775BDK3MME2 Description
e200z7 MPC57xx Microcontroller IC 32-Bit Dual-Core 220MHz 4MB (4M x 8) FLASH 416-MAPBGA (27x27)
Tech Specifications
Mfr
NXP USA Inc.
Series
MPC57xx
Package
Tray
Core Processor
e200z7
Program Memory Type
FLASH
RAM Size
512K x 8
Number of I/O
293
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
416-BGA
Supplier Device Package
416-MAPBGA (27x27)
Base Product Number
SPC5775
Speed
220MHz
Core Size
32-Bit Dual-Core
Connectivity
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals
DMA, LVD, POR, Zipwire
Program Memory Size
4MB (4M x 8)
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
Data Converters
A/D 40x12b eQADCx2
Oscillator Type
External
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Design/Specification
MPC5775 DS Update 17/Apr/2020SPC577x 31/Mar/2023
PCN Assembly/Origin
SPC5777C Assembly Site Add 4/Aug/2019
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
SPC5775BDK3MME2 Documents
Download datasheets and manufacturer documentation for SPC5775BDK3MME2
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