Renesas Electronics America Inc
R7F7016514ABG-C#AC1
Microcontrollers
R7F7016514ABG-C#AC1
4-R7F7016514ABG-C#AC1
32BIT MCU RH850/F1KM-S4
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R7F7016514ABG-C#AC1 Description
Tech Specifications
Mfr
Renesas Electronics America Inc
Series
RH850/F1x
Package
Tray
Core Processor
RH850G3KH
Program Memory Type
FLASH
RAM Size
512K x 8
Number of I/O
174
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
233-FBGA
Supplier Device Package
233-FBGA (15x15)
Speed
240MHz
EEPROM Size
64K x 8
Core Size
32-Bit
Connectivity
CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals
DMA, PWM, WDT
Program Memory Size
4MB (4M x 8)
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
Data Converters
A/D 38x10b, 32x12b
Oscillator Type
Internal
R7F7016514ABG-C#AC1 Documents
Download datasheets and manufacturer documentation for R7F7016514ABG-C#AC1
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