NXP Semiconductors_MCR705JP7CDWE
NXP Semiconductors_MCR705JP7CDWE
NXP Semiconductors

MCR705JP7CDWE

Microcontrollers
NXP Semiconductors
MCR705JP7CDWE
4-MCR705JP7CDWE
IC MCU 8BIT 6KB OTP 28SOIC
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MCR705JP7CDWE Description

Tech Specifications

Mfr
NXP USA Inc.
Series
HC05
Package
Bulk
Core Processor
HC05
Program Memory Type
OTP
RAM Size
224 x 8
Number of I/O
22
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295", 7.50mm Width)
Supplier Device Package
28-SOIC
Base Product Number
MCR705
Speed
2.1MHz
Core Size
8-Bit
Connectivity
SIO
Peripherals
POR, Temp Sensor, WDT
Program Memory Size
6KB (6K x 8)
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
Data Converters
A/D 4x12b
Oscillator Type
Internal
Featured Product
Ticket Vending Machine
PCN Obsolescence/ EOL
Multiple Devices 21/Nov/2013
PCN Assembly/Origin
Fab Site Transfer 24/Jul/2009

MCR705JP7CDWE Documents

Download datasheets and manufacturer documentation for MCR705JP7CDWE

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service