NXP Semiconductors
MC9S12DG128CPVE557
Microcontrollers
MC9S12DG128CPVE557
4-MC9S12DG128CPVE557
MICROCONTROLLER 16-BIT FLASH,
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MC9S12DG128CPVE557 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
HCS12
Package
Bulk
Core Processor
HCS12
Program Memory Type
FLASH
RAM Size
8K x 8
Number of I/O
91
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
112-LQFP
Supplier Device Package
112-LQFP (20x20)
Base Product Number
MC9S12
Speed
25MHz
EEPROM Size
2K x 8
Core Size
16-Bit
Connectivity
CANbus, I²C, SCI, SPI
Peripherals
PWM, WDT
Program Memory Size
128KB (128K x 8)
Voltage - Supply (Vcc/Vdd)
2.35V ~ 5.25V
Data Converters
A/D 16x10b
Oscillator Type
Internal
MC9S12DG128CPVE557 Documents
Download datasheets and manufacturer documentation for MC9S12DG128CPVE557
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