NXP Semiconductors
MC11E1CPBE2R
Microcontrollers
MC11E1CPBE2R
4-MC11E1CPBE2R
IC MCU 8BIT ROMLESS 52TQFP
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MC11E1CPBE2R Description
Tech Specifications
Mfr
NXP USA Inc.
Series
HC11
Package
Tape & Reel (TR)
Core Processor
HC11
Program Memory Type
ROMless
RAM Size
512 x 8
Number of I/O
38
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
52-LQFP
Supplier Device Package
52-TQFP (10x10)
Base Product Number
MC11E1
Speed
2MHz
EEPROM Size
512 x 8
Core Size
8-Bit
Connectivity
SCI, SPI
Peripherals
POR, WDT
Voltage - Supply (Vcc/Vdd)
4.5V ~ 5.5V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Assembly/Origin
Fab Site Transfer 24/Jul/2009
PCN Packaging
All Dev Label Update 15/Dec/2020
MC11E1CPBE2R Documents
Download datasheets and manufacturer documentation for MC11E1CPBE2R
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Shopping Guide
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