Renesas Electronics America Inc
DS70830AN80BGV
Microcontrollers
DS70830AN80BGV
4-DS70830AN80BGV
IC MCU 32BIT ROMLESS 112LFBGA
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DS70830AN80BGV Description
Tech Specifications
Mfr
Renesas Electronics America Inc
Series
SuperH® SH7080
Package
Tray
Core Processor
SH-2
Program Memory Type
ROMless
RAM Size
16K x 8
Number of I/O
65
Operating Temperature
-20°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
112-LFBGA
Supplier Device Package
112-LFBGA (10x10)
Base Product Number
DS70830
Speed
80MHz
Core Size
32-Bit Single-Core
Connectivity
EBI/EMI, FIFO, I²C, SCI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
Data Converters
A/D 8x10b SAR
Oscillator Type
Internal
PCN Obsolescence/ EOL
Mult Dev EOL 15/Dec/2021
PCN Packaging
Label Change-All Devices 01/Dec/2022
DS70830AN80BGV Documents
Download datasheets and manufacturer documentation for DS70830AN80BGV
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Shopping Guide
Payment Methods
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Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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